Carbon Ink Pcb, Multilayer Side Pcb, Rigid Pcb manufacturer / supplier in China, offering Carbon Ink PCB with UL RoHS Certified, Impedance Control+Gold Finished, Large Size PCB and so on.Send Inquiry
Model NO.:Carbon Ink PCB
Type:Rigid Circuit Board
Flame Retardant Properties:V0
Layer:1_18 Layer Rigid Circuit Board
Surface Finish:Hal Lead Free/OSP(Entek)/Immersion Gold/Immersion
Silkscreen:White,Black,Yellow,Carbon Ink,Peelable Mask
Copper Thickness:18um(0.5oz)--175um(4 Oz)
Board Thickness:From Min. 0.2mm to Max. 0.6mm
Conductor Trace and Gap:Min. 0.125.(5mil)
Pth Wall Thickness:0.025mm
A. Very competitive price
B. Fast lead time from 2 days
C. Perfect service and good relationship with customer
D. Good quality. Welcome to order all kinds OEM ODM PCB!
Mission: To become a leading PCB manufacture in China. Customer' satisfaction is more important than profit. Keep good quality and on time delivery is essential to satisfy clients.
To do right the first time and do right every time.
Our company is ISO 9001 certificated and UL approved,all of PCB are manufacturing under a stable management.
Quality is commercial integrity 1% defect may brings 100% disaster for customer.Our management goad is to make client 100% satisfied.Offering perfect products is essential to satisfy clients.
We use good brand based on material and solder mask
In order to increase the reliability and performance,we never use local and
unknown brand supplier.
Enough copper thickness inside hole
Since some of our customer has complained the problem of les copper, we have improved and pay more attention the copper thickness inside hole.
It's important because we know if not have enough copper inside hole it will increase the risk of electrical continuity problems (blow hoes, out gassing, inner layer separation, barrel cracking)
We platted to 25 um on normal board.
No short or open circuit repair
Poor repair can actually lead to open circuits being supplied. Even a "good" repair has risk of failure under oad conditions (vibration etc.) leading to potential field failures.
|PCB Layers||1-24 Layers|
|Copper Thickness||0.5-6 OZ|
|Min.Annual Ring PTH||0.15mm|
|Hole Aspect Ratio||10|
|Min.Board Thickness||Singel&Double side 0.2mm|
|Max Board Sixe||600*900mm,400*1200mm|
|Solder Mask Pitch||0.1mm|
|thickness Tolerance||MIL-P-13949 Class 2|
|Surface Finish||HASL,LF HAL,Immersion Gold,Immersion silver,Flash Gold,Flux Coat&OSP|
|Special Capability||Burial/blind vias,Impedance Control,via plug,BGA,Gold Finger|
|Test||Fly probe test,E-test,Inspection AOI test|