SMT pcb peelable carbon ink PCB

- Aug 05, 2017 -

Product Information


2.Detailed Terms for PCB Assembly:

Technical RequirementProfessional Surface-mounting and Through-hole soldering Technology
Various sizes like 1206, 0805, 0603 components SMT technology
ICT(In Circuit Test), FCT(Functional Circuit Test) technology
PCB Assembly With UL, CE, FCC, Rohs Approval
Nitrogen gas reflow soldering technology for SMT
High Standard SMT&Solder Assembly Line
High density interconnected board placement technology capacity
Quote&Production RequirementGerber File or PCB File for Bare PCB Board Fabrication
BOM(Bill of Material) for Assembly, PNP(Pick and Place file) and Components Position also needed in assembly
To reduce the quote time, please provide us the full part number for each components, Quantity per board also the quantity for orders.
Testing Guide&Function Testing method to ensure the quality to reach nearly 0% scrap rate
OEM/ODM/EMS ServicesPCBA, PCB assembly: SMT & PTH & BGA
PCBA and enclosure design
Components sourcing and purchasing
Quick prototyping
Plastic injection molding
Metal sheet stamping
Final assembly
Test: AOI, In-Circuit Test (ICT), Functional Test (FCT)
Custom clearance for material importing and product exporting
Other  PCB Assembly EquipmentsSMT Machine: SIEMENS SIPLACE D1/D2 / SIEMENS SIPLACE S20/F4
Reflow Oven: FolunGwin FL-RX860
Wave Soldering Machine: FolunGwin ADS300
Automated Optical Inspection (AOI): Aleader ALD-H-350B,X-RAY Testing Service

Fully Automatic SMT Stencil Printer: FolunGwin Win-5


Production Line

PCBA production line.jpg

Packing & Shipping

packing and shipping.jpg

Packing2.jpg

packing 5.jpg

? All of the above description is to demonstrate the ability of our factory, if you have specific requirements, please contact us.

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