Xing DA Electric Technology Co.,Ltd

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+86-755-23050569

Multilayer VIA IN PAD PCB
Multilayer VIA IN PAD PCB

Multilayer VIA IN PAD PCB

With more than 10 years of pcb experience along with excellent quality, advanced services and competitive prices, XD has won numerous customers' trust and support. Our service include PCB fabrication, assembly, component sourcing, program&function test and housing assembly

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  • Product Details

VIA IN PAD PCB:Vias in pad is normally to be plugged with non-conductive epoxy and then plated caps. Filling non-conductive epoxy/resin is more cheaper than filling copper. And this filling gives better result for soldering as it can avoid tin flowing into holes when assembly.

 

Other PCB Service:

Based in Shenzhen Xinda Electric Tech Ltd specialized in electronic design, PCB manufacture, PCB assembly, and component sourcing services, also could provide:

---PCB&PCBA Contract Manufacturing

---Reverse Engineering Services

---PCB design and assembly

---Component Procurement & Material Management

---Product Design

---Fast PCB&PCBA Prototyping

---Cable and Wire Assemblies

---Plastics and Molds

---AOI, X-Ray Testing, other Function Testing Service

 

PCB specification:

Item

Mass production

Small batch production 

Number of Layers

UP TO 16L

 UP TO 18L

Laminate

FR-4,Halogen free,High TG,Cem-3,PTFE,Aluminum  BT,Rogers

Maximum board size

610*460mm

635*546

Board thickness

0.3-3.5mm

0.2-6.0mm

Minimum line width/space

0.1/0.1mm

0.076/0.076mm

Minimum line gap

 +/-15%

+/-10% 

Outer layer copper thickness

140um

210um 

Inner layer copper thickness

70um

150um

Min.finished hole size(Mechanical)

 0.2mm

0.15mm

Min.finished hole size (laser hole)

0.1mm

 0.1mm

Aspect ratio

10:01

13:01

Solder Mask Color

Green,Blue,Black,White,Yellow,Red,Grey

Impedance control Tolerance

  <=+/-10%

Surface Treatment

Flash Gold

 0.025-0.075um

0.025-0.5um 

Immersion Gold

 0.05-0.1um

 0.1-0.2um

Sn/Pb Hasl

 1-70um


Leadfree Hasl

 1-70um


Immersion Silver

 0.08-0.3um


OSP(Entek)

 0.2-0.4um


Gold Finger

 0.375um<X<1.75um

>=1.75um 

Hard Gold Plating

 0.375um<X<1.75um

 >=1.75um

Immsion Sn

 0.8um<X<=1.20um


V-Cut


V-Cut degree

 20,30,45,60


Outline Profile

Chamfer

The angle type of the chamfer

 30,45,60


Plug via hole

Max.size can be plugged

 0.6mm

0.7mm 

Largest NPTH hole size

 6.5mm

>6.5mm 

Largest PTH hole size

 6.5mm

>6.5mm 

Min.annular ring can be kept

 0.15mm

0.1mm 

Min.distance between the IC pads can keep Sm bridge

 0.25mm

0.2mm

Min.SM bridge for green soldermask

 0.1mm

0.076mm 

Min.SM bridge for black soldermask

 0.125mm

0.1mm 

Tolerance of dimension size

 <=+/-0.13mm

+/-0.1mm 

Tolerance of board thickness

 >=1.0mm   +/-10%

+/-8% 

 <1.0mm     +/-0.1mm

Tolerance of finished NPTH hole size

 +/-0.05mm

 +/-0.05mm

Tolerance of finished PTH hole size

 +/-0.076mm

+/-0.05mm 

Delivery time

Mass:10~12d

Sample:5~7D

Capacity

35000sq/m

CAM capability

 20 Items

The briefly process for VIA IN PAD as beow,


material cutting→drilling→PTH→plating→non-conductive epoxy plugging→polish→drilling through hole→PTH→plating→outer layer pattern→plating→etching→solder mask→surface finish→routing→testing→FQC→package.


 

About us

1. As for Service, we provide 7-24 on-line professional Pre-sale, Selling and After-Sale service to solve any question about the order. Any time, any requirement will get Prompt Reply from our well-trained and friendly support staff.

 

2. Our aggressive business strategy enables us to deliver high competitive services for our diverse, competitive customer base. Through this strategy, we are able to make fast, flexible decisions in response to changing market conditions and create most value and benefits for customers.

 

3. As for Market, because of our high standard of production and excellent service, now we have gained countless customers and good reputation from all over the world, especially in North America, Europe, Oceania and South America. In the future, we will put much more effort to build connection with more customers in more area. All we want to do, is to connect the world by our products, to share the Value, Happiness and Achievement with more customers.

 

 

 


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